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PSM-66 RIV-01/02 belongs to the conventional halogen-free hole plugging resin, the resin doesn't contain solvents and other harmful volatiles, suitable for vertical machine resin hole plugging process, good bonding with the PCB substrate and copper surface, high heat resistance, low water absorption, easy to grind, and good flatness.
Fields of application
PSM-66 RIV01/02 plugging resin is suitable for inner and outer layers, H02, POFV, high thickness-to-diameter ratio, plugging process, mainly for conventional ordinary FR-4 products.
Illustration of plug holes for each type of plate
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Technical Specifications
| NO. | Physical indicators | Test Methods | Reference Standard | Test results |
| 1 | Product Appearance | visual assessment | / | Yellowish white |
| 2 | Solid Content | Thermal Weightlessness | GB 1725-79 | 100% |
| 3 | Tg | TMA（℃） | IPC-TM-650 2.4.24 | 150-160 |
| 4 | CTE | TMA（＜Tg）α1（ppm） | IPC-TM-650 2.4.24 | 40-50 |
| TMA（＞Tg）α2（ppm） | IPC-TM-650 2.4.24 | 95-105 | ||
| 5 | Water Absorption | Gravimetric method（%） | IPC-TM-650 2.6.2.1 | <0.1 |
| 6 | Hardness | Pencil method | IPC-TM-650 2.4.27.2 | ≥7H |
| 7 | Insulation Resistance | Voltage method（Ω） | GB/T 10064-2006 | 1-3*10¹³ |
| 8 | Adhesion | Baige +3m tape method | IPC-TM-650 2.4.1 | 100/100 |
| 9 | Heat-proof material | Reflow soldering 260℃.60sec.3 cycles | IPC-TM-650 2.1.1.2 | Pass |
Thermal Stress 288℃.10sec.5 cycles | IPC-TM-650 2.6.8 | Pass | ||
| 10 | Chemical corrosion resistance | 10wt% NaOH 25℃*30min | IPC-TM-650 2.3.4.3 | Pass |
| 11 | TCT test | -50℃/30minó150℃/30min | IPC-TM-650 2.6.7.2 | Pass |
| 1000cycles | ||||
| 12 | Viscosity（25℃） | VISCOMETER TV-06 | - | 400-600 |
